Rocky Mountain Vacuum Tech. Inc.

RMET-R2000L Seires

RIE Series

ETCHER VACUUM EQUIPMENTS

    Reactive ion Etching (RIE) is an etching technology that utilizes
    chemically reactive plasma to remove masked materials
    deposited on wafers during microfabrication.

Overview


 Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive

plasma to remove masked materials deposited on wafers during microfabrication. The

combination of an electromagnetic field in a low pressure (vacuum) environment is

used to create a plasma source from which high energy ions attack a wafer surface and

react.



Features


High selectivity, uniform plasma etching


Simple configuration makes maintenance easy


Negative self-bias forms on lower electrode


Low damage & contamination


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