Overview
Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive
plasma to remove masked materials deposited on wafers during microfabrication. The
combination of an electromagnetic field in a low pressure (vacuum) environment is
used to create a plasma source from which high energy ions attack a wafer surface and
react.
Features
≻ High selectivity, uniform plasma etching
≻ Simple configuration makes maintenance easy
≻ Negative self-bias forms on lower electrode
≻ Low damage & contamination